XZ028 | XPTP.P
【EXCELLENT THERMAL CONDUCTIVITY】:
Upgraded thermal silica gel material with 22.5±0.1 W/mK thermal conductivity, Density (G/cc): 2.6 g/cc ,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
【EASY & CONVENIENT TO USE】:
Dimension 38x38x0.25mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
SPEC
General Data
- Model
- XZ028 | XPTP.P
- Dimension
- 38 × 38 × 0.25-0.3mm
- Contents
- 15% Hydrocarbon, 85% Inorganic filler
- Thermal conductivity
- 22.5±0.1W/m-K
- Thermal impedance
- <0.011℃ - in2/W
- Thermal resistance
- 0.29K/W
- Density
- 2.6g/cc
- Thickness
- 0.25 – 0.3mm
- Stored temperature
- -50~250℃
- Operating temperature
- -40~125℃