XZ029 | XPTP.P5
Experience the next generation of heat dissipation with our high-quality CPU thermal pad!
Designed for demanding gamers and tech enthusiasts, this pad offers foolproof installation with no spills or smudges.
Simply apply, put on the CPU – done! The pad ensures optimum heat transfer and at the same time protect the valuable hardware.
SPEC
General Data
- Model
- XZ029 | XPTP.P5
- Dimension
- 38 × 50 × 0.25mm
- Contents
- 15% Hydrocarbon, 85% Inorganic filler
- Thermal conductivity
- 22.5±0.1W/m-K
- Thermal impedance
- <0.011℃ - in2/W
- Thermal resistance
- 0.29K/W
- Density
- 2.6g/cc
- Thickness
- 0.25 – 0.3mm
- Stored temperature
- -50~250℃
- Operating temperature
- -40~125℃